Huawei is poised to adopt Tongfu Microelectronics' HBM2 components for its AI chips, marking a significant advancement in China's semiconductor industry. Tongfu, a leading chip assembly firm, has begun trial production of HBM2, which, despite being 2-3 generations behind Nvidia's HBM3E, is expected to bolster China's AI capabilities amid ongoing US sanctions. Other Chinese companies, including CXMT and Wuhan Xinxin, are also making strides in DRAM and HBM technologies, further enhancing the nation's tech landscape.